On July 24, NVIDIA announced a multi-year strategic partnership with global semiconductor packaging leader Amkor Technology, with a total value of approximately $1.5 billion. According to the agreement, NVIDIA will make an upfront payment to focus on supporting Amkor's expansion of advanced packaging and testing capacity in Arizona, USA, and jointly advance the R&D of packaging and testing technologies for next-generation artificial intelligence (AI) and data center acceleration computing systems.

This collaboration focuses on the R&D of advanced packaging technologies such as high-density interconnects and heterogeneous integration, aiming to efficiently integrate chips and components of different processes into a single system, significantly improving chip performance and energy efficiency, and breaking through data transmission bottlenecks. As a long-term packaging supplier for NVIDIA's data center processors and network chips, this collaboration further expands the relationship between the two companies to future computing platform development. Debora Shoquist, Executive Vice President of NVIDIA's Operations, and Kevin Engel, CEO of Amkor, both stated that advanced packaging has become a core component driving generational AI technology transformation.

Currently, multi-chip collaboration is replacing single computing power stacking, and advanced packaging has upgraded from a backend process to a key factor determining the upper limit of AI computing power. NVIDIA's move not only accelerates the packaging and testing deployment of core components such as GPUs and HBM but also extends the manufacturing supply chain to the U.S. domestic market, building a more resilient and diversified global supply structure, laying a solid foundation for the long-term expansion of global AI computing infrastructure.