Silicon photonics startup

Core Pain Point: Breaking the "Physical Limit" of Copper Wires
With the rapid growth of AI model sizes, traditional copper interconnects have become a bottleneck for computing power expansion. When transmission rates exceed 800Gbps, the transmission distance of copper cables is limited to just a few meters, and they face challenges of high power consumption and error rates.
Ultra-high bandwidth: The latest reference design integrates eight TeraPHY chips, achieving a total bandwidth of up to 200Tbps per package, about seven times that of NVIDIA Rubin GPU (28.8Tbps).
Low power consumption and long-distance transmission: Compared to traditional pluggable optical modules, CPO technology directly integrates the optical module within the GPU package, significantly reducing power consumption and latency, and the link is not restricted by a single rack.
Scalability: This technology supports connecting up to 10,000 GPUs in an extended domain, while keeping the rack power density around 100kW.
