Siemens officially announced yesterday that it has completed the acquisition of French semiconductor AI startup Canopus AI. The transaction was closed secretly on January 12, 2026, aiming to inject powerful AI capabilities into its core Calibre wafer manufacturing software platform by introducing cutting-edge **Computational Metrology** technology.

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Transaction Details: Deepening the Technological Advantage in Grenoble

Although Siemens did not disclose specific financial terms, industry analysts estimate the transaction amount to be between 150 million and 300 million euros (approximately 1.23 billion to 2.46 billion Chinese yuan).

  • Target Company: Canopus AI, founded in Grenoble, France in 2021.

  • Core Competitiveness: Specializes in using machine learning and artificial intelligence to optimize semiconductor metrology and inspection processes, with unique algorithms particularly for addressing edge placement error (EPE).

Core Technology: "Metrospection" Framework Breaks Barriers

Canopus AI introduced the "Metrospection" concept in the industry. This innovative software framework uses AI technology to bridge the technical gap between traditional wafer metrology and inspection:

  • Interactive Review: Engineers can interactively review critical dimension scanning electron microscope (CD-SEM) images and high-volume manufacturing (HVM) data through its proprietary Mapbox-like web viewer.

  • Model Optimization: This technology can accurately measure edge placement error (EPE), thereby significantly optimizing the physical simulation models used in wafer manufacturing.

Strategic Intent: Targeting Sub-Nanometer Process Control

As the global semiconductor industry moves into 2nm and more advanced process nodes, yield control has become a "life-or-death" issue for wafer fabs. Siemens plans to deeply integrate Canopus AI's technology with Calibre's existing "computational lithography" capabilities:

  • End-to-End Solution: Providing a closed-loop EDA solution from design to physical simulation of manufacturing.

  • Yield Acceleration: By achieving precise sub-nanometer process control, helping manufacturers shorten mass production cycles and significantly accelerate yield ramp-up (Yield Ramp).

Tony Hemmelgarn, President of Siemens Digital Industrial Software, stated that this acquisition reflects Siemens' determination to apply Industrial AI to solve manufacturing challenges, further solidifying its leading position in the EDA field for advanced process nodes.